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Good old Samsung and the mania with thinness. After finally vouchsafing the 30nm 32Gb NAND chips out of the bag in May, the Korean mental recall builder has right away successfully halved the density of the octa-die mental recall package to a shockingly thin 0.6mm (or 0.02 inches). The latest stacks will begin out at a 32GB size, yet the genuine benefits have been likelier to be felt down the line when the capability to container pieces some-more densely pays off in even higher storage capacities. Cellphones, media players and digital cameras will fundamentally take the lion’s share, but we’re carefree — almighty optimists which we have been — which this could accelerate the decrease of SSD prices to a equivocal affordable level. Intel and Micron promised us as much, how about Samsung delivering it?

[Via Information Week]

Filed under: Storage

Samsung slims down NAND mental recall packaging, wafer-thin gadgets to follow creatively appeared on Engadget on Fri, 06 November 2009 08:19:00 EST. Please see the terms for operate of feeds.

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